Descubre los productos 5
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural
658-35ABT4E
Wakefield-Vette
5,941
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.350" (8.89mm) - -
7020B-MTG
Aavid, Thermal Division of Boyd Corporation
6,099
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 TAB FOLD 42.16MM
- Board Level, Vertical Rectangular, Fins 1.450" (36.83mm) 1.300" (33.02mm) Bolt On and PC Pin TO-220 0.470" (11.94mm) 8.0W @ 70°C 8.70°C/W
658-35AB
Wakefield-Vette
3,025
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQBLK W/O TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Not Included) BGA 0.350" (8.89mm) - -
658-35ABT3
Wakefield-Vette
1,243
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.350" (8.89mm) - -
658-35ABT4
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.350" (8.89mm) - -