- Type:
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- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Wakefield-Vette |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINKS BOARD LEVEL PWR SEMI
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274 | Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.250" (6.35mm) | 9.00°C/W @ 400 LFM | - | Black Anodized | ||||
Wakefield-Vette |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK ALUM BLACK SMD
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218 | Top Mount | Copper | 0.320" (8.13mm) | 0.900" (22.86mm) | SMD Pad | SMD | 0.400" (10.16mm) | 21.00°C/W @ 200 LFM | 31.00°C/W | Tin |