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- Condiciones seleccionadas:
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Wakefield-Vette |
6,156
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SM FOOTPRINT BLK
|
272 | Board Level | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | - | Bolt On and PC Pin | TO-220, TO-202 | 0.375" (9.52mm) | 4.0W @ 42°C | 3.60°C/W @ 400 LFM | ||||
TE Connectivity AMP Connectors |
357
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BGA 25MM 7FIN RADIAL
|
- | - | Cylindrical | - | - | 1.375" (34.92mm) OD | Clip | BGA | 0.894" (22.71mm) | - | 3.80°C/W @ 200 LFM |