Fabricante:
Series:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
272-AB
Wakefield-Vette
6,156
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 SM FOOTPRINT BLK
272 Board Level Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - Bolt On and PC Pin TO-220, TO-202 0.375" (9.52mm) 4.0W @ 42°C 3.60°C/W @ 400 LFM
4-1542005-0
TE Connectivity AMP Connectors
357
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK BGA 25MM 7FIN RADIAL
- - Cylindrical - - 1.375" (34.92mm) OD Clip BGA 0.894" (22.71mm) - 3.80°C/W @ 200 LFM