- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
3,240
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 POWER W/PINS BK
|
TO-220 | 2.00°C/W @ 300 LFM | 2.60°C/W | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
4,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218 10W H=2.5" BLK
|
TO-218 | 2.00°C/W @ 300 LFM | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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TO-218 | 1.00°C/W @ 800 LFM | 8.00°C/W |
