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- Condiciones seleccionadas:
Descubre los productos 11
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products |
3,956
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | - | Black Anodized | ||
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CTS Thermal Management Products |
969
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | - | Black Anodized | ||
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|
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CTS Thermal Management Products |
368
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | - | Black Anodized | ||
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|
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CTS Thermal Management Products |
438
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | - | Black Anodized | ||
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Wakefield-Vette |
339
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 31X31X23MM ELLIPTICAL
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906 | Top Mount | Aluminum | Square, Fins | 1.220" (30.99mm) | 1.220" (30.99mm) | Clip | BGA | 0.892" (22.65mm) | - | 8.90°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
80
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 300X25X35MM
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- | Top Mount | Aluminum | Rectangular, Fins | 11.800" (299.72mm) | 0.984" (25.00mm) | Adhesive | - | 1.378" (35.00mm) | - | 13.00°C/W | Degreased | ||
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Advanced Thermal Solutions Inc. |
67
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3 dias |
-
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MOQ: 1 MPQ: 1
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MAXIGRIP FANSINK 37.5X37.5X9.5MM
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fanSINK, maxiGRIP | Top Mount | Aluminum | Square, Pin Fins | 1.476" (37.50mm) | 1.476" (37.50mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | - | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
88
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3 dias |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 40X40.5X13.5MM
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- | Top Mount | Copper | Square, Fins | 1.594" (40.50mm) | 1.575" (40.00mm) | Push Pin | BGA | 0.531" (13.49mm) | - | 13.30°C/W | AavSHIELD 3C | ||
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Advanced Thermal Solutions Inc. |
100
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 40MM X 40MM X 14.5MM
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maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | - | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | Bolt On | TO-218 | 1.000" (25.40mm) | 16.0W @ 50°C | 3.80°C/W | Black Anodized | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK MULTIWATT 2.0" BLK
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677 | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247, Multiwatt | 1.000" (25.40mm) | 6.0W @ 40°C | 6.70°C/W | Black Anodized |
