- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 2.500" (63.50mm) | Bolt On | TO-218 | 16.0W @ 50°C | 3.80°C/W | ||
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Wakefield-Vette |
Consulta
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- |
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MOQ: 1 MPQ: 1
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HEATSINK MULTIWATT 2.0" BLK
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677 | Board Level, Vertical | 2.000" (50.80mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247, Multiwatt | 6.0W @ 40°C | 6.70°C/W |
