- Series：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 2,067
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
Advanced Thermal Solutions Inc. |
122
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 25.25°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
117
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 21.46°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
93
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 14.33°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
62
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X17.78MM FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 17.42°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 25.25°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
93
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 21.46°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
92
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 14.33°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
95
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 25.25°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
85
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 21.46°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X17.78MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 17.42°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 14.33°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
95
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 21.46°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X17.78MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 17.42°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 25.25°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X17.78MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 17.42°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM T766
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | 14.33°C/W @ 100 LFM | Blue Anodized | |||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DC DC 1/4 BRICK VERT
|
537 | Top Mount | Bolt On | Quarter Brick DC/DC Converter | 0.950" (24.13mm) | 2.10°C/W @ 300 LFM | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X5.84MM FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | 25.23°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X11.43MM FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | 21.45°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X17.78MM FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | 17.40°C/W @ 100 LFM | Blue Anodized |
