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- Attachment Method：
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- Package Cooled：
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- Condiciones seleccionadas:
Descubre los productos 56
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid，Thermal Division of Boyd Corporation |
51,138
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 BLK
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- | Board Level | Aluminum | Rectangular，Fins | 0.700" (17.78mm) | 1.750" (44.45mm) | - | Bolt On | TO-220 | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | 15.60°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
24,011
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-220 .375" COMPACT
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 3.0W @ 80°C | 12.00°C/W @ 200 LFM | 25.90°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
11,699
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375" D2PAK
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- | Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | 1.020" (25.91mm) | - | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
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ASSMANN WSW Components |
6,080
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 19.05x9.52MM
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- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | - | Bolt On | TO-220 | - | - | 24.00°C/W | Black Anodized | ||
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Wakefield-Vette |
11,297
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOW HEIGHT BLK
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274 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 2.0W @ 56°C | 8.00°C/W @ 400 LFM | 28.00°C/W | Black Anodized | ||
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ASSMANN WSW Components |
5,932
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 19.05X13.21MM
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | - | - | 24.00°C/W | Black Anodized | ||
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Wakefield-Vette |
5,670
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SM FOOTPRINT BLK
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270 | Board Level | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | 1.750" (44.45mm) | - | Bolt On | TO-220, TO-202 | 4.0W @ 70°C | 6.00°C/W @ 400 LFM | 17.50°C/W | Black Anodized | ||
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Wakefield-Vette |
6,905
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOW HEIGHT BLK
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273 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | - | Bolt On | TO-220, TO-218 | 2.0W @ 49°C | 7.20°C/W @ 400 LFM | 24.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
3,384
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB .375"
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On and PC Pin | TO-220 | 1.0W @ 30°C | 8.00°C/W @ 400 LFM | 25.90°C/W | Black Anodized | ||
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Wakefield-Vette |
6,156
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SM FOOTPRINT BLK
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272 | Board Level | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | - | Bolt On and PC Pin | TO-220, TO-202 | 4.0W @ 42°C | 3.60°C/W @ 400 LFM | 10.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
7,914
|
3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | - | Clip | TO-220 | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | 25.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
13,536
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 DUAL 10W
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- | Board Level | Aluminum | Rectangular, Fins | 1.470" (37.34mm) | 1.750" (44.45mm) | - | Bolt On | TO-220 (Dual) | 8.0W @ 70°C | 3.00°C/W @ 200 LFM | 9.60°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
15,536
|
3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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- | Board Level, Vertical | Copper | Rectangular, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | - | Bolt On and PC Pin | TO-220 | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 25.80°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,068
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 1W H=.375" BLK
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- | Board Level | Aluminum | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 1.8W @ 90°C | 30.00°C/W @ 200 LFM | 57.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
4,893
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 25.4MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.550" (39.37mm) | - | Bolt On and PC Pin | TO-220 | 3.0W @ 40°C | 8.00°C/W @ 100 LFM | 11.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
2,934
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 55.12MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.968" (49.99mm) | 1.986" (50.44mm) | - | Bolt On and PC Pin | TO-220 | 10.0W @ 70°C | 1.75°C/W @ 800 LFM | 6.50°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
1,536
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 (DUAL)
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- | Board Level | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | - | Bolt On | TO-220 (Dual) | - | 3.00°C/W @ 200 LFM | 9.60°C/W | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
2,568
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOW PROFILE
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- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | - | Bolt On | TO-220 | - | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
7,409
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-202 LOW PROFILE.375"
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-202 | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 27.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
3,782
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375"TO-220
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- | Board Level, Vertical | Copper | Rectangular, Fins | 1.100" (27.94mm) | 0.866" (22.00mm) | - | Clip and PC Pin | TO-220 | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 19.20°C/W | Tin |
