- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Material | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Advanced Thermal Solutions Inc. |
919
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STEEL W/TAB
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Steel | Bolt On and Board Mounts | - | 14.00°C/W @ 200 LFM | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Copper | Bolt On and PC Pin | 0.6W @ 30°C | 5.00°C/W @ 700 LFM |
