- Material:
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- Length:
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- Width:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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Descubre los productos 13
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
3,384
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB .375"
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | TO-220 | 1.0W @ 30°C | 8.00°C/W @ 400 LFM | 25.90°C/W | Black Anodized | ||||
Wakefield-Vette |
6,156
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SM FOOTPRINT BLK
|
272 | Board Level | Aluminum | 1.450" (36.83mm) | 1.750" (44.45mm) | TO-220, TO-202 | 4.0W @ 42°C | 3.60°C/W @ 400 LFM | 10.50°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
15,536
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375"TO-220
|
- | Board Level, Vertical | Copper | 0.750" (19.05mm) | 0.750" (19.05mm) | TO-220 | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 25.80°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
4,893
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB FOLD 25.4MM
|
- | Board Level, Vertical | Aluminum | 1.000" (25.40mm) | 1.550" (39.37mm) | TO-220 | 3.0W @ 40°C | 8.00°C/W @ 100 LFM | 11.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
2,934
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB FOLD 55.12MM
|
- | Board Level, Vertical | Aluminum | 1.968" (49.99mm) | 1.986" (50.44mm) | TO-220 | 10.0W @ 70°C | 1.75°C/W @ 800 LFM | 6.50°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
1,944
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB BLACK
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | TO-220 | - | 15.60°C/W @ 200 LFM | 25.90°C/W | Black Anodized | ||||
ASSMANN WSW Components |
254
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | TO-220 | - | - | 24.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Copper | 0.750" (19.05mm) | 0.520" (13.21mm) | TO-220 | 0.6W @ 30°C | 5.00°C/W @ 700 LFM | 35.70°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | 0.700" (17.78mm) | 1.750" (44.45mm) | TO-220 | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | 15.60°C/W | Black Anodized | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW PROFILE BLK TO-220
|
7 | Board Level | Aluminum | 0.682" (17.32mm) | 1.750" (44.45mm) | TO-220 | 3.0W @ 40°C | - | 14.00°C/W | Black Anodized | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HORZ .375"H BLK TO-220
|
7 | Board Level | Aluminum | 0.682" (17.32mm) | 1.750" (44.45mm) | TO-220 | 3.0W @ 40°C | - | 14.70°C/W | Black Anodized | ||||
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DUAL HORZ BLACK TO-220
|
7 | Board Level | Aluminum | 1.450" (36.83mm) | 1.750" (44.45mm) | TO-220 | 6.0W @ 50°C | - | 9.00°C/W | Black Anodized | ||||
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 9.5X13.2X19.1MM
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | TO-220 | 1.0W @ 30°C | 12.00°C/W @ 200 LFM | - | Black Anodized |