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- Length:
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- Width:
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- Diameter:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 21
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
Ohmite |
4,608
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR TO-220 BLK
|
W | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.201" (30.50mm) | 0.720" (18.29mm) | - | Clip and PC Pin | TO-220 | 0.630" (16.00mm) | 1.0W @ 20°C | - | Black Anodized | ||||
ASSMANN WSW Components |
3,125
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM TO-220
|
- | Top Mount | Aluminum | Rectangular, Fins | 0.787" (20.00mm) | 1.142" (29.00mm) | - | Bolt On | TO-220 | 0.472" (12.00mm) | - | - | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
5,511
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-3 .500" COMPACT
|
- | Board Level | Aluminum | Rhombus | 1.880" (47.75mm) | 1.400" (35.56mm) | - | Bolt On | TO-3 | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | Black Anodized | ||||
Wakefield-Vette |
308
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X23MM ELLIPTICAL
|
901 | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Clip | BGA | 0.892" (22.65mm) | - | 4.90°C/W @ 200 LFM | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
1,439
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 ALUMINUM
|
- | Board Level, Vertical | Aluminum | Rectangular, Angled Fins | 2.362" (60.00mm) | 0.985" (25.00mm) | - | Bolt On and Board Mounts | TO-220 | 0.335" (8.50mm) | - | 6.70°C/W @ 200 LFM | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
36
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X139X7.4MM
|
- | Top Mount | Aluminum | Rectangular, Fins | 11.800" (299.72mm) | 5.472" (139.00mm) | - | Adhesive | - | 0.291" (7.40mm) | - | 4.40°C/W @ 200 LFM | Degreased | ||||
Ohmite |
806
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK W/CLIP FOR TO-264
|
W | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | 0.921" (23.40mm) | - | Clip and PC Pin | TO-264 | 0.630" (16.00mm) | 1.0W @ 20°C | 8.00°C/W @ 500 LFM | Unfinished | ||||
Advanced Thermal Solutions Inc. |
21
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X120.75X16.6M
|
- | Top Mount | Aluminum | Rectangular, Fins | 11.800" (299.72mm) | 4.756" (120.80mm) | - | Adhesive | - | 0.654" (16.60mm) | - | 1.00°C/W @ 200 LFM | Degreased | ||||
Ohmite |
37
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CERAMIC HEATSINK WITH CLIP
|
WC | Board Level, Vertical | Ceramic | Rectangular, Fins | 0.803" (20.40mm) | 1.339" (34.00mm) | - | Clip and PC Pin | TO-220, TO-247, TO-264 | 1.512" (38.40mm) | - | - | - | ||||
TE Connectivity AMP Connectors |
7
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BGA 37.5MM 2FIN RADIAL
|
- | - | Aluminum | Cylindrical | - | - | 1.375" (34.92mm) OD | Clip | BGA | 0.357" (9.07mm) | - | 6.30°C/W @ 200 LFM | Black Anodized | ||||
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.030" (0.76mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||||
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.030" (0.76mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||||
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.030" (0.76mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||||
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.030" (0.76mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||||
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.030" (0.76mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X12MM PIN
|
906 | Top Mount | Aluminum | Square, Pin Fins | 1.220" (30.99mm) | 1.220" (30.99mm) | - | Clip | BGA | 0.457" (11.60mm) | - | 3.40°C/W @ 200 LFM | Black Anodized | ||||
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.030" (0.76mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||||
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.030" (0.76mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||||
American Technical Ceramics |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.030" (0.76mm) | 0.020" (0.51mm) | - | SMD Pad | - | 0.020" (0.51mm) | - | - | - | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
.5X.25X.34 HEATSINK FOR DIODE
|
258 | Board Level | Aluminum | Rectangular | 0.250" (6.35mm) | 0.500" (12.70mm) | - | Type 120 Compound | Stud Mounted Diode | 0.340" (8.64mm) | - | - | - |