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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
7,409
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3 dias |
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MOQ: 1 MPQ: 1
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HEATSINK TO-202 LOW PROFILE.375"
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Board Level | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-202 | 0.375" (9.52mm) | 8.00°C/W @ 500 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK 40-PIN DIP GLUE-ON BLK
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Top Mount | 2.000" (50.80mm) | 0.530" (13.46mm) | Thermal Tape, Adhesive (Not Included) | 40-DIP | 0.190" (4.83mm) | 16.00°C/W @ 300 LFM |
