Fabricante:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise
507222B00000G
Aavid, Thermal Division of Boyd Corporation
13,536
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 DUAL 10W
TO-220 (Dual) 0.375" (9.52mm) 8.0W @ 70°C
ATS-PCB1021
Advanced Thermal Solutions Inc.
2,884
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 DUAL BLACK
TO-220 0.380" (9.65mm) -