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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Square, Fins | 0.655" (16.64mm) | 0.655" (16.64mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.265" (6.73mm) | 1.0W @ 40°C | Black Anodized | ||
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.9X8X10.2MM
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Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 2.5W @ 35°C | Tin |
