Fabricante:
Attachment Method:
Package Cooled:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Shape Length Width Diameter Attachment Method Package Cooled Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
4-1542005-0
TE Connectivity AMP Connectors
357
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK BGA 25MM 7FIN RADIAL
- Cylindrical - - 1.375" (34.92mm) OD Clip BGA 3.80°C/W @ 200 LFM 10.50°C/W Black Anodized
V6534E1-T
ASSMANN WSW Components
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
Board Level, Vertical Rectangular, Fins 0.393" (10.00mm) 0.984" (25.00mm) - PC Pin TO-220 - 35.20°C/W Tin
V6534B-T
ASSMANN WSW Components
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
Board Level, Vertical Rectangular, Fins 0.393" (10.00mm) 0.984" (25.00mm) - PC Pin TO-220 - 35.20°C/W Black Anodized