Fabricante:
Series:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Width Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
V-1100-SMD/B
ASSMANN WSW Components
18,400
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
- 0.790" (20.07mm) D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W
V-1100-SMD/B
ASSMANN WSW Components
18,715
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
- 0.790" (20.07mm) D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W
V-1100-SMD/B
ASSMANN WSW Components
18,715
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
- 0.790" (20.07mm) D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W
V-1100-SMD/B-L
ASSMANN WSW Components
430
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
- 0.790" (20.07mm) D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W
218-40CT3
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM BLACK SMD
218 0.900" (22.86mm) SMD 0.400" (10.16mm) 2.0W @ 62°C 21.00°C/W @ 200 LFM 31.00°C/W