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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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CTS Thermal Management Products |
546
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.61"SQ
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BDN | Top Mount | Square, Pin Fins | 1.610" (40.89mm) | 1.610" (40.89mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | 4.50°C/W @ 400 LFM | ||
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Advanced Thermal Solutions Inc. |
761
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 BLACK
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- | Board Level | Rectangular, Fins | 1.630" (41.40mm) | 1.291" (32.80mm) | Bolt On | TO-3 | 0.748" (19.00mm) | 4.40°C/W @ 200 LFM |
