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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
488
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 2W BLK
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Top Mount | Aluminum | Cylindrical | - | - | 0.750" (19.05mm) OD | Threaded Coupling | TO-5, TO-39 | 0.290" (7.37mm) | 20.00°C/W @ 300 LFM | 35.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | Aluminum | Rectangular, Fins | 0.602" (15.29mm) | - | - | Press Fit | TO-92 | 1.220" (31.00mm) | 20.00°C/W @ 200 LFM | 40.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Copper | Rectangular, Fins | 1.025" (26.04mm) | 1.005" (25.53mm) | - | Clip and PC Pin | TO-218 | 0.610" (15.49mm) | 4.00°C/W @ 500 LFM | 23.10°C/W | Tin | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 13.1X13.2X24MM
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Board Level, Vertical | Copper | Rectangular, Fins | 0.848" (21.55mm) | 0.520" (13.21mm) | - | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 12.00°C/W @ 500 LFM | - | Tin |
