- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.025" (26.04mm) | 1.005" (25.53mm) | TO-218 | 0.610" (15.49mm) | 4.00°C/W @ 500 LFM | 23.10°C/W | ||
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 13.1X13.2X24MM
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0.848" (21.55mm) | 0.520" (13.21mm) | TO-220 | 0.515" (13.08mm) | 12.00°C/W @ 500 LFM | - |
