- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Height Off Base (Height of Fin) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Height Off Base (Height of Fin) | ||
CUI Inc. |
995
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
|
Board Level | 0.591" (15.00mm) | - | 0.500" (12.70mm) | ||||
CUI Inc. |
996
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | 0.590" (15.00mm) | ||||
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | 0.590" (15.00mm) |