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- Condiciones seleccionadas:
Descubre los productos 283
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
17,584
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT MNT W/TAB
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- | Board Level, Vertical | Aluminum | 1.375" (34.93mm) | 0.860" (21.84mm) | Clip and PC Pin | TO-220 | 0.395" (10.03mm) | 2.5W @ 40°C | 6.00°C/W @ 400 LFM | 16.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
7,570
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOCKING TAB CLIP
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- | Board Level | Aluminum | 0.800" (20.32mm) | 0.268" (6.81mm) | Clip | TO-220 | 1.000" (25.40mm) | 1.5W @ 40°C | 4.00°C/W @ 500 LFM | 23.00°C/W | Black Anodized | ||
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t-Global Technology |
166
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3 dias |
-
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MOQ: 1 MPQ: 1
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PH3 101.6X38.1X0.21MM
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PH3 | Heat Spreader | Copper | 4.000" (101.60mm) | 1.500" (38.10mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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Advanced Thermal Solutions Inc. |
1,230
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLACK
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- | Board Level | Aluminum | 0.748" (19.00mm) | 0.504" (12.80mm) | Clip | TO-220 | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | Black Anodized | |||
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CTS Thermal Management Products |
2,818
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK PRESS ON .25"H BLK TO-5
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7 | Top Mount | Aluminum | 0.700" (17.78mm) | 0.325" (8.26mm) | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | - | 58.00°C/W | Black Anodized | ||
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American Technical Ceramics |
2,000
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3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 13.00°C/W | - | ||
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American Technical Ceramics |
2,800
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3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 13.00°C/W | - | ||
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American Technical Ceramics |
2,800
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3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 13.00°C/W | - | ||
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American Technical Ceramics |
7,000
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3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 7.00°C/W | - | ||
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American Technical Ceramics |
7,836
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3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 7.00°C/W | - | ||
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American Technical Ceramics |
7,836
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 7.00°C/W | - | ||
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American Technical Ceramics |
500
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3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 7.00°C/W | - | ||
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American Technical Ceramics |
936
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 7.00°C/W | - | ||
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American Technical Ceramics |
936
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | 7.00°C/W | - | ||
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American Technical Ceramics |
250
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.370" (9.40mm) | 0.245" (6.22mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 6.00°C/W | - | ||
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American Technical Ceramics |
250
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | - | 0.245" (6.22mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 6.00°C/W | - | ||
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American Technical Ceramics |
250
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | - | 0.245" (6.22mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 6.00°C/W | - | ||
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American Technical Ceramics |
1,000
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 20.00°C/W | - | ||
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American Technical Ceramics |
1,990
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 20.00°C/W | - | ||
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American Technical Ceramics |
1,990
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | 0.060" (1.52mm) | 0.030" (0.76mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | 20.00°C/W | - |
