- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
7,570
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOCKING TAB CLIP
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Board Level | Aluminum | 0.800" (20.32mm) | 0.268" (6.81mm) | Clip | 1.5W @ 40°C | 4.00°C/W @ 500 LFM | 23.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | 1.675" (42.55mm) | 1.000" (25.40mm) | Bolt On and PC Pin | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | - | 1.675" (42.55mm) | 1.000" (25.40mm) | Bolt On and PC Pin | 1.5W @ 20°C | 3.00°C/W @ 700 LFM | 12.40°C/W | Tin |
