- Material：
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- Width：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 71
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | Copper | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | Copper | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 dias |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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- | Top Mount | Copper | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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Ohmite |
9,471
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263 BLACK
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D | Top Mount | Aluminum | 1.020" (25.91mm) | - | Solderable Feet | TO-263 (D2Pak) | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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ASSMANN WSW Components |
1,010
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | 1.031" (26.20mm) | - | SMD Pad | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,250
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Top Mount | Copper | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Ohmite |
1,400
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268
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D | Top Mount | Aluminum | 1.580" (40.13mm) | - | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Degreased | ||
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Ohmite |
1,452
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268
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D | Top Mount | Aluminum | 1.580" (40.13mm) | - | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Degreased | ||
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Ohmite |
1,452
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268
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D | Top Mount | Aluminum | 1.580" (40.13mm) | - | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Degreased | ||
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Ohmite |
3,336
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263
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D | Top Mount | Aluminum | 1.020" (25.91mm) | - | Solderable Feet | TO-263 (D2Pak) | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Ohmite |
8,200
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268
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D | Top Mount | Aluminum | 1.580" (40.13mm) | - | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Black Anodized | ||
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|
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Ohmite |
8,640
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268
|
D | Top Mount | Aluminum | 1.580" (40.13mm) | - | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Black Anodized | ||
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|
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Ohmite |
8,640
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268
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D | Top Mount | Aluminum | 1.580" (40.13mm) | - | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Black Anodized | ||
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|
Advanced Thermal Solutions Inc. |
2,297
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
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- | Top Mount | Copper | 1.031" (26.20mm) | - | - | TO-263 (D2Pak) | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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|
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ASSMANN WSW Components |
3,600
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | 1.031" (26.20mm) | - | SMD Pad | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
3,836
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | 1.031" (26.20mm) | - | SMD Pad | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
3,836
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | 1.031" (26.20mm) | - | SMD Pad | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin |
