- Series：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 2,084
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
14,552
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 PWR CLR 1.45"10W
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- | Board Level | 0.780" (19.81mm) | Bolt On | TO-220 (Dual) | 0.850" (21.60mm) | 4.0W @ 40°C | 5.00°C/W @ 200 LFM | 6.40°C/W | Black Anodized | ||
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Wakefield-Vette |
6,156
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SM FOOTPRINT BLK
|
272 | Board Level | 1.750" (44.45mm) | Bolt On and PC Pin | TO-220, TO-202 | 0.375" (9.52mm) | 4.0W @ 42°C | 3.60°C/W @ 400 LFM | 10.50°C/W | Black Anodized | ||
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CUI Inc. |
1,485
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 6.8W ALUMINUM
|
- | Board Level | 0.700" (17.80mm) | Bolt On | TO-220 | 0.850" (21.60mm) | 6.8W @ 75°C | 3.47°C/W @ 200 LFM | 14.33°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
7,219
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 FOLD 42.16MM
|
- | Board Level | 1.300" (33.02mm) | Bolt On | TO-220 | 0.470" (11.94mm) | 8.0W @ 70°C | 4.00°C/W @ 500 LFM | 8.70°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
8,970
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 1.45" HIGH
|
- | Board Level | 1.006" (25.55mm) | Bolt On | TO-220 | 0.787" (19.99mm) | 1.5W @ 20°C | 4.00°C/W @ 300 LFM | 12.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
6,099
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB FOLD 42.16MM
|
- | Board Level, Vertical | 1.300" (33.02mm) | Bolt On and PC Pin | TO-220 | 0.470" (11.94mm) | 8.0W @ 70°C | 3.00°C/W @ 800 LFM | 8.70°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
1,536
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 (DUAL)
|
- | Board Level | 1.750" (44.45mm) | Bolt On | TO-220 (Dual) | 0.375" (9.52mm) | - | 3.00°C/W @ 200 LFM | 9.60°C/W | Black Anodized | |||
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CUI Inc. |
1,434
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 6.5W ALUMINUM
|
- | Board Level | 1.750" (44.45mm) | Bolt On | TO-220 | 0.370" (9.40mm) | 6.5W @ 75°C | 3.76°C/W @ 200 LFM | 11.54°C/W | Black Anodized | ||
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ASSMANN WSW Components |
539
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 36.83X17.80MM
|
- | Board Level | 0.700" (17.78mm) | Bolt On | TO-220 | 0.850" (21.60mm) | - | - | 7.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
27
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM FP
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pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
89
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM FP
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.12°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
63
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM FP
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
88
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
90
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
86
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM T766
|
pushPIN | Top Mount | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.12°C/W @ 100 LFM | - | Blue Anodized |
