Descubre los productos 7
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Length Width Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
658-60ABT4E
Wakefield-Vette
7,117
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 27.9MM SQ W/ADH BLK
658 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) 2.5W @ 30°C 2.00°C/W @ 500 LFM
658-60AB
Wakefield-Vette
4,276
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/OTAPE
658 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Not Included) 2.5W @ 30°C 2.00°C/W @ 500 LFM
658-60ABT3
Wakefield-Vette
2,122
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) 2.5W @ 30°C 2.00°C/W @ 500 LFM
630-60AB
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK FOR BGA 35MM
630 1.378" (35.00mm) 1.378" (35.00mm) Thermal Tape, Adhesive (Not Included) - 3.00°C/W @ 350 LFM
658-60ABT1
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) 2.5W @ 30°C 2.00°C/W @ 500 LFM
658-60ABT2
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) 2.5W @ 30°C 2.00°C/W @ 500 LFM
658-60ABT4
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 27.9MM SQ W/ADH BLK
658 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) 2.5W @ 30°C 2.00°C/W @ 500 LFM