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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
539
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 36.83X17.80MM
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Board Level | 1.450" (36.83mm) | Bolt On | TO-220 | 0.850" (21.60mm) | - | - | 7.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 20-DIP BLK ANODIZED
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Top Mount | 1.055" (26.80mm) | Press Fit, Slide On | 20-DIP | 0.556" (14.12mm) | 2.0W @ 60°C | 20.00°C/W @ 200 LFM | 39.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 18-DIP BLK ANODIZED
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Top Mount | 1.125" (28.58mm) | Press Fit, Slide On | 18-DIP | 0.556" (14.12mm) | 2.0W @ 60°C | 20.00°C/W @ 200 LFM | 39.00°C/W |
