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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Ohmite |
2,414
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-220 218 247 1.0"
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R | Board Level, Vertical | Rectangular, Fins | 1.654" (42.00mm) | 0.985" (25.00mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.000" (25.40mm) | 2.0W @ 20°C | 1.50°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
135
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN 50.8MM
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- | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Rhombus | 1.550" (39.37mm) | 1.550" (39.37mm) | Bolt On | TO-3 | 1.500" (38.10mm) | 6.0W @ 30°C | 2.00°C/W @ 400 LFM |
