- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 31
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Wakefield-Vette |
385
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 19X19X12MM PIN
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901 | Square, Pin Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Clip | BGA | 6.60°C/W @ 200 LFM | 12.70°C/W | ||
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Wakefield-Vette |
823
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 27X27X12MM PIN
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904 | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | Clip | BGA | 4.30°C/W @ 200 LFM | 12.90°C/W | ||
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Wakefield-Vette |
2,281
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 35X35X12MM ELLIPTICAL
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908 | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 3.10°C/W @ 200 LFM | 11.10°C/W | ||
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CTS Thermal Management Products |
360
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/THERMAL TAPE
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APR | Square, Pin Fins | 1.047" (26.60mm) | 1.047" (26.60mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
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Wakefield-Vette |
881
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 40X40X12MM PIN
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910 | Square, Pin Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip | BGA | 2.80°C/W @ 200 LFM | 9.20°C/W | ||
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Wakefield-Vette |
335
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 21X21X12MM PIN
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902 | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Clip | BGA | 5.80°C/W @ 200 LFM | 14.30°C/W | ||
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Wakefield-Vette |
293
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 27X27X12MM ELLIPTICAL
|
904 | Square, Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | Clip | BGA | 4.80°C/W @ 200 LFM | 11.40°C/W | ||
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Wakefield-Vette |
243
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK 31X31X12MM ELLIPTICAL
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906 | Square, Fins | 1.220" (30.99mm) | 1.220" (30.99mm) | Clip | BGA | 3.50°C/W @ 200 LFM | 10.70°C/W | ||
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Wakefield-Vette |
191
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 35X35X12MM PIN
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908 | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 3.10°C/W @ 200 LFM | 11.10°C/W | ||
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|
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Wakefield-Vette |
380
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 19X19X12MM ELLIPTICAL
|
901 | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Clip | BGA | 6.60°C/W @ 200 LFM | 14.70°C/W | ||
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Wakefield-Vette |
269
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 21X21X12MM ELLIPTICAL
|
902 | Square, Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Clip | BGA | 6.60°C/W @ 200 LFM | 12.40°C/W | ||
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 31X31X12MM PIN
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906 | Square, Pin Fins | 1.220" (30.99mm) | 1.220" (30.99mm) | Clip | BGA | 3.40°C/W @ 200 LFM | 12.00°C/W | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 40X40X12MM ELLIPTICAL
|
910 | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip | BGA | 3.10°C/W @ 200 LFM | 10.00°C/W | ||
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/THERMAL TAPE
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APR | Square, Pin Fins | 1.283" (32.60mm) | 1.283" (32.60mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APR | Square, Pin Fins | 1.366" (34.70mm) | 1.366" (34.70mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.50°C/W @ 200 LFM | - | ||
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|
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/THERMAL TAPE
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APR | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 27 X 27 X 12MM
|
APR | Square, Pin Fins | 1.047" (26.60mm) | 1.047" (26.60mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH SMALL CLIP
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APR | Square, Pin Fins | 1.047" (26.60mm) | 1.047" (26.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH MEDIUM CLIP
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APR | Square, Pin Fins | 1.047" (26.60mm) | 1.047" (26.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
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|
CTS Thermal Management Products |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH TALL CLIP
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APR | Square, Pin Fins | 1.047" (26.60mm) | 1.047" (26.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - |
