- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Condiciones seleccionadas:
Descubre los productos 4
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 3.6W ALUMINUM
|
Top Mount | 0.279" (7.10mm) | 0.787" (20.00mm) | - | 1.000" (25.40mm) | 7.45°C/W @ 200 LFM | 20.83°C/W | ||||
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 3.6W ALUMINUM
|
Board Level | 0.748" (19.00mm) | 0.830" (21.08mm) | - | 0.394" (10.00mm) | 5.39°C/W @ 200 LFM | 20.59°C/W | ||||
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 3.6W ALUMINUM
|
Board Level, Vertical | 0.394" (10.00mm) | 0.830" (21.08mm) | PC Pin | 0.748" (19.00mm) | 5.39°C/W @ 200 LFM | 20.59°C/W | ||||
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 3.6W ALUMINUM
|
Board Level, Vertical | 0.394" (10.00mm) | 0.830" (21.08mm) | PC Pin | 0.748" (19.00mm) | 5.39°C/W @ 200 LFM | 20.59°C/W |