- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Bolt On | TO-218 | 2.50°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Bolt On and PC Pin | TO-220 | 2.00°C/W @ 300 LFM |
