- Material：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Condiciones seleccionadas:
Descubre los productos 12
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,699
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D-PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,914
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375"TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | Clip | TO-220 | 0.375" (9.52mm) | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | 25.00°C/W | Black Anodized | ||
|
|
|
CUI Inc. |
4,921
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.6W ALUMINUM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.375" (9.53mm) | Clip | TO-220 | 0.740" (18.79mm) | 2.6W @ 75°C | 6.32°C/W @ 200 LFM | 28.85°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
267
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR .75"H BLACK TO-220
|
- | Board Level | Aluminum | Rhombus | 1.310" (33.27mm) | Bolt On | TO-126, TO-220 | 0.750" (19.05mm) | - | 7.00°C/W @ 200 LFM | 50.00°C/W | Black Anodized | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-252, 8 X
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | - | TO-252 (DPAK) | 0.400" (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM BLACK SMD
|
218 | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | SMD Pad | SMD | 0.400" (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 0.848" (21.55mm) | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Copper | Rectangular, Fins | 0.700" (17.78mm) | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 9.5X22.8X17.8MM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | Clip | TO-220 | 0.375" (9.52mm) | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 22.9X8X10.2MM
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin |
