- Series：
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- Type：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
73
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 58MM X 30MM X 9MM
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maxiFLOW | Top Mount | Rectangular, Angled Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.354" (9.00mm) | 4.80°C/W @ 200 LFM | - | |||
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CUI Inc. |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK HALF BRICK ALUM BLACK
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- | Board Level | Square, Fins | 2.402" (61.00mm) | Bolt On | Half Brick DC/DC Converter | 0.940" (23.88mm) | 2.10°C/W @ 200 LFM | 4.70°C/W |
