- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
8,163
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-126 13.20X19.68MM
|
Board Level, Vertical | 0.520" (13.21mm) | Press Fit, Slide On | TO-126 | 0.320" (8.13mm) | - | - | 26.00°C/W | ||
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Advanced Thermal Solutions Inc. |
586
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-126 BLACK
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Board Level | 0.520" (13.21mm) | Bolt On | TO-126 | 0.319" (8.10mm) | - | 25.00°C/W @ 200 LFM | 35.80°C/W | |||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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Board Level | 0.787" (20.00mm) | - | TO-220 | 0.303" (7.70mm) | 4.1W @ 75°C | 7.05°C/W @ 200 LFM | 18.29°C/W | ||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.4W ALUMINUM
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Board Level, Vertical | 0.303" (7.70mm) | PC Pin | TO-220 | 0.790" (20.00mm) | 3.4W @ 75°C | 7.46°C/W @ 200 LFM | 22.06°C/W |
