- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 8.0W @ 40°C | 3.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.840" (46.74mm) | 0.490" (12.44mm) | Bolt On and PC Pin | TO-220, TO-247 | 1.750" (44.45mm) | 4.0W @ 30°C | 6.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
1.840" (46.74mm) | 0.490" (12.44mm) | Bolt On and PC Pin | TO-218, TO-247 | 1.750" (44.45mm) | 4.0W @ 30°C | 6.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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1.840" (46.74mm) | 0.490" (12.44mm) | Clip and PC Pin | TO-218, TO-247 | 1.750" (44.45mm) | 4.0W @ 30°C | 6.30°C/W |
