- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
948
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 35MM SQ H=.45" BLK
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Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | 6.00°C/W @ 500 LFM | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEAT SINK WITH THERMAL TAPE
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Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | 8.00°C/W @ 400 LFM |
