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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 23
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
6,015
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS 1.5"TALL
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
6,500
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
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- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
6,648
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
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- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220
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- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,216
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3 dias |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .45" D2PAK
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- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,893
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 25.4MM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.550" (39.37mm) | - | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 3.0W @ 40°C | 8.00°C/W @ 100 LFM | Black Anodized | ||
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Ohmite |
820
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK W/CLIP FOR TO-264
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W | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | 0.921" (23.40mm) | - | Clip and PC Pin | TO-264 | 0.630" (16.00mm) | 1.0W @ 20°C | 8.00°C/W @ 500 LFM | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,596
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 BLACK
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- | Board Level | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.551" (39.40mm) | - | Bolt On | TO-220 | 0.374" (9.50mm) | - | 6.80°C/W @ 200 LFM | Black Anodized | |||
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ASSMANN WSW Components |
1,136
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.374" (34.90mm) | - | PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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American Technical Ceramics |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | - | SMD Pad | - | 0.025" (0.64mm) | - | - | - | ||
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American Technical Ceramics |
508
|
3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | - | SMD Pad | - | 0.025" (0.64mm) | - | - | - | ||
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American Technical Ceramics |
508
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3 dias |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | - | SMD Pad | - | 0.025" (0.64mm) | - | - | - | ||
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ASSMANN WSW Components |
410
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.378" (35.00mm) | - | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
293
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.374" (34.90mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
382
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM
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- | Board Level | Aluminum | Rectangular, Fins | 1.476" (37.50mm) | 1.142" (29.00mm) | - | Bolt On | KLP | 0.472" (12.00mm) | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.550" (39.37mm) | - | Bolt On | TO-220 | 0.375" (9.52mm) | 3.0W @ 40°C | 8.00°C/W @ 100 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.380" (35.05mm) | - | Bolt On | TO-218 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 1.644" (41.76mm) | 1.290" (32.77mm) | - | Bolt On | TO-220 | 1.000" (25.40mm) | - | 3.80°C/W @ 200 LFM | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Clip and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | Black Anodized |
