- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
4,893
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 25.4MM
|
Board Level, Vertical | 1.550" (39.37mm) | Bolt On and PC Pin | 0.375" (9.52mm) | 3.0W @ 40°C | 8.00°C/W @ 100 LFM | ||
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Advanced Thermal Solutions Inc. |
2,596
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
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Board Level | 1.551" (39.40mm) | Bolt On | 0.374" (9.50mm) | - | 6.80°C/W @ 200 LFM | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level | 1.550" (39.37mm) | Bolt On | 0.375" (9.52mm) | 3.0W @ 40°C | 8.00°C/W @ 100 LFM |
