- Series：
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- Material：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 29
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
11,699
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
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- | Top Mount | Copper | Rectangular, Fins | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
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Advanced Thermal Solutions Inc. |
2,973
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 26.20°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
998
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 29.50°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
975
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 7.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 19.70°C/W @ 200 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
231
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 13.40°C/W @ 200 LFM | - | Black Anodized | |||
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|
Advanced Thermal Solutions Inc. |
1,318
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 10.50°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
712
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 17.5MM
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maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | - | 8.70°C/W @ 200 LFM | - | Blue Anodized | |||
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|
Advanced Thermal Solutions Inc. |
139
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.354" (9.00mm) | - | 12.00°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
444
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | - | 12.00°C/W @ 200 LFM | - | Black Anodized | |||
|
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Advanced Thermal Solutions Inc. |
524
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 14.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 21.40°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
143
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 15.10°C/W @ 200 LFM | - | Black Anodized | |||
|
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Advanced Thermal Solutions Inc. |
47
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 11.70°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 12.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | - | 11.70°C/W @ 200 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 14.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 19.10°C/W @ 200 LFM | - | Black Anodized | |||
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CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 14.
|
- | Top Mount | Copper | Rectangular, Fins | 1.020" (25.91mm) | - | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | Tin | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
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|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 15X15X14.5MM W/3M8815
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 19.10°C/W @ 200 LFM | - | Black Anodized | |||
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|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 15X15X9.5MM W/OUT TIM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.374" (9.50mm) | - | 26.20°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 15X15X9.5MM W/OUT TIM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.374" (9.50mm) | - | 29.50°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 15X15X14.5MM W/OUT TIM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.571" (14.50mm) | - | 19.10°C/W @ 200 LFM | - | Black Anodized |
