- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 9
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | 1.040" (26.42mm) | TO-66 | 1.250" (31.75mm) | 7.0W @ 50°C | 4.00°C/W @ 200 LFM | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | 1.040" (26.42mm) | TO-66 | 0.500" (12.70mm) | 2.0W @ 30°C | 7.00°C/W @ 200 LFM | 10.70°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | 1.040" (26.42mm) | TO-66 | 0.750" (19.05mm) | 6.0W @ 60°C | 2.00°C/W @ 800 LFM | 9.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | 1.040" (26.42mm) | TO-66 | 1.000" (25.40mm) | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | 1.550" (39.37mm) | TO-3 | 1.225" (31.12mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.550" (39.37mm) | TO-3 | 1.750" (44.45mm) | 10.0W @ 50°C | 2.00°C/W @ 400 LFM | 4.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.550" (39.37mm) | TO-3 | 1.500" (38.10mm) | 6.0W @ 30°C | 2.00°C/W @ 400 LFM | 4.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.550" (39.37mm) | TO-3 | 2.000" (50.80mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 4.20°C/W | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK
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7 | 1.040" (26.42mm) | TO-66 | 0.750" (19.05mm) | 6.0W @ 60°C | - | 12.00°C/W |
