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- Length:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
44
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 300X6X8MM
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Top Mount | Rectangular, Fins | 11.800" (299.72mm) | 0.236" (6.00mm) | - | Adhesive | - | 0.315" (8.00mm) | - | 65.00°C/W | Degreased | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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TO-5 PUSH-ON HEATSINK
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Board Level | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | Press Fit | TO-5 | 0.400" (10.16mm) | 1.0W @ 70°C | 90.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | Press Fit | TO-5 | 0.400" (10.16mm) | 1.0W @ 70°C | 90.00°C/W | Hard Anodized |