- Series：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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Advanced Thermal Solutions Inc. |
212
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 23MM X 23MM X 9.5MM
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- | Thermal Tape, Adhesive (Included) | 0.374" (9.50mm) | 0.3W @ 20°C | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
54
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 23MM X 23MM X 9.5MM
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maxiGRIP | Clip, Thermal Material | 0.374" (9.50mm) | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
69
|
3 dias |
-
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MOQ: 1 MPQ: 1
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SUPERGRIP HEATSINK 23X23X7.5MM
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superGRIP | Clip, Thermal Material | 0.295" (7.50mm) | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK 23X23X9.5MM W/OUT TIM
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- | Thermal Tape, Adhesive (Not Included) | 0.374" (9.50mm) | 0.3W @ 20°C | Black Anodized |
