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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Wakefield-Vette |
927
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK DPAK SMT TIN PLATED
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217 | Copper | Rectangular, Fins | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | Tin | ||
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Advanced Thermal Solutions Inc. |
92
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 300X25.4X4MM
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- | Aluminum | Rectangular, Fins | 11.800" (299.72mm) | 1.000" (25.40mm) | Adhesive | - | 0.157" (4.00mm) | - | 24.80°C/W @ 200 LFM | Degreased | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINKS
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217 | Copper | Rectangular, Fins | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | Tin | ||
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|
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Wakefield-Vette |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK DPAK SMT TIN PLATED
|
217 | Copper | Rectangular | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | Tin |
