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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Wakefield-Vette |
243
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 31X31X12MM ELLIPTICAL
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906 | Top Mount | Square, Fins | 1.220" (30.99mm) | 1.220" (30.99mm) | Clip | BGA | 0.457" (11.60mm) | - | 3.50°C/W @ 200 LFM | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
66
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 300X80X30MM
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- | Top Mount | Rectangular, Fins | 11.800" (299.72mm) | 3.150" (80.00mm) | Adhesive | - | 1.181" (30.00mm) | - | 0.40°C/W @ 800 LFM | Degreased | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Rhombus | 1.550" (39.37mm) | 1.040" (26.42mm) | Bolt On | TO-66 | 0.500" (12.70mm) | 2.0W @ 30°C | 7.00°C/W @ 200 LFM | Black Anodized |
