- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 4
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
Ohmite |
1,270
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BLACK ANODIZED
|
CSM | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.492" (12.50mm) | Solderable Feet | TO-220 | 1.228" (31.20mm) | 2.0W @ 44°C | 18.00°C/W | Black Anodized | ||||
t-Global Technology |
4,065
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 12X12X10MM W/TAPE
|
- | Heat Spreader | Ceramic | Square, Fins | 0.472" (12.00mm) | Thermal Tape, Adhesive (Included) | - | 0.394" (10.00mm) | - | - | - | ||||
t-Global Technology |
1,145
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 12X12X10MM
|
- | Heat Spreader | Ceramic | Square, Fins | 0.472" (12.00mm) | - | - | 0.394" (10.00mm) | - | - | - | ||||
t-Global Technology |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CERAMIC HEATSINK
|
- | Top Mount | Ceramic | Square, Pin Fins | 0.472" (12.00mm) | Thermal Tape, Adhesive (Included) | - | 0.394" (10.00mm) | - | - | - |