- Material：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 29
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
42,175
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK VERT PLUG-IN TO-220
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
13,880
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 5W BLK
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.5W @ 40°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
15,923
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT/HORZ MOUNT
|
- | Board Level | Aluminum | Rectangular, Fins | 0.600" (15.24mm) | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | 26.80°C/W | Black Anodized | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
14,905
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
5,136
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK HORIZ PLUG-IN TO-220
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- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
11,530
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
3,545
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/INSTALL TAB
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Clip and Board Locks | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 26.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
10,548
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
- | Board Level | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
9,752
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON/TAB
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.600" (15.24mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | 26.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
1,014
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON/TAB
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 7.00°C/W @ 200 LFM | 18.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
1,742
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-220 BLACK CLIP-ON
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- | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Clip | TO-220 | 0.500" (12.70mm) | 3.0W @ 60°C | 7.00°C/W @ 200 LFM | 18.80°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,948
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIPON W/TAB
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | - | 7.00°C/W @ 200 LFM | 20.00°C/W | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
3,574
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLACK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.600" (15.24mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | 26.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
18,071
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK MOD BLACK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.5W @ 40°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
1,355
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-218/TO-247
|
- | Board Level, Vertical | Aluminum | Rectangular, Angled Fins | 1.750" (44.45mm) | Clip and Board Mounts | TO-218, TO-220, TO-247 | 1.750" (44.45mm) | - | 2.30°C/W @ 200 LFM | 6.30°C/W | Black Anodized | |||
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t-Global Technology |
385
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 50.8X12.07X0.062MM
|
PH3n | Heat Spreader | Copper | Rectangular | 2.000" (50.80mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
238
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 50.8X12.07X0.07MM
|
PH3n | Heat Spreader | Copper | Rectangular | 2.000" (50.80mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
116
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3 50.8X12.07X0.21MM
|
PH3 | Heat Spreader | Copper | Rectangular | 2.000" (50.80mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
|
|
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CUI Inc. |
971
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.6W ALUMINUM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.520" (13.21mm) | PC Pin | TO-220 | 0.748" (19.00mm) | 2.6W @ 75°C | 10.49°C/W @ 200 LFM | 29.09°C/W | Black Anodized | ||
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|
|
t-Global Technology |
51
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X12.07X0.062MM
|
PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester |
