- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 7
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
385
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3 dias |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 50.8X12.07X0.062MM
|
PH3n | Heat Spreader | Copper | 2.000" (50.80mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | Polyester | ||
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|
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t-Global Technology |
238
|
3 dias |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 50.8X12.07X0.07MM
|
PH3n | Heat Spreader | Copper | 2.000" (50.80mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | Polyester | ||
|
|
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t-Global Technology |
116
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3 50.8X12.07X0.21MM
|
PH3 | Heat Spreader | Copper | 2.000" (50.80mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | Polyester | ||
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t-Global Technology |
51
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3 dias |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X12.07X0.062MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | Polyester | ||
|
|
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t-Global Technology |
21
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3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X12.07X0.07MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | Polyester | ||
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t-Global Technology |
24
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3 dias |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X12.07X0.21MM
|
PH3 | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | Polyester | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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.5X.25X.34 HEATSINK FOR DIODE
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258 | Board Level | Aluminum | 0.250" (6.35mm) | Type 120 Compound | Stud Mounted Diode | 0.340" (8.64mm) | 12.00°C/W | - |
