- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
9,535
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TIN CLIP-ON 13MM
|
Board Level | Clip and PC Pin | 1.5W @ 50°C | 8.00°C/W @ 500 LFM | 28.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
761
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .515"TO-220
|
Board Level, Vertical | Clip and PC Pin | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | 20.30°C/W | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
976
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TIN CLIP-ON 21MM
|
Board Level | Clip and Board Locks | 1.0W @ 30°C | 8.00°C/W @ 400 LFM | 20.30°C/W |
