- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Attachment Method | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
761
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .515"TO-220
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Board Level, Vertical | Clip and PC Pin | 10.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
976
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TIN CLIP-ON 21MM
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Board Level | Clip and Board Locks | 8.00°C/W @ 400 LFM |
