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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
5,077
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LIGHTWEIGHT .5"
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Board Level | Aluminum | 0.710" (18.03mm) | 1.000" (25.40mm) | Bolt On | 0.500" (12.70mm) | 2.0W @ 40°C | 4.00°C/W @ 700 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
761
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .515"TO-220
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Board Level, Vertical | Copper | 0.780" (19.81mm) | 0.520" (13.21mm) | Clip and PC Pin | 0.515" (13.08mm) | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
976
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TIN CLIP-ON 21MM
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Board Level | Copper | 0.780" (19.81mm) | 0.520" (13.21mm) | Clip and Board Locks | 0.515" (13.08mm) | 1.0W @ 30°C | 8.00°C/W @ 400 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | 0.710" (18.03mm) | 0.955" (24.26mm) | Bolt On and PC Pin | 0.500" (12.70mm) | 2.0W @ 40°C | 4.00°C/W @ 700 LFM | Black Anodized |
