- Type:
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- Diameter:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Wakefield-Vette |
8,135
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BOLT-ON BLK
|
291 | Board Level | Rectangular, Fins | 0.860" (21.84mm) | 1.000" (25.40mm) | - | Bolt On | TO-220 | 0.360" (9.14mm) | 2.0W @ 68°C | 16.00°C/W @ 600 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
24,857
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 24-PIN DIP GLUE-ON BLK
|
- | Top Mount | Rectangular, Fins | 1.250" (31.75mm) | 0.530" (13.46mm) | - | Thermal Tape, Adhesive (Not Included) | 24-DIP | 0.190" (4.83mm) | 1.0W @ 40°C | 15.00°C/W @ 500 LFM | ||||
CTS Thermal Management Products |
953
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PRESS ON .50"H BLK TO-5
|
7 | Top Mount | Cylindrical | - | - | 0.440" (11.18mm) OD | Press Fit | TO-5 | 0.500" (12.70mm) | 2.0W @ 60°C | - |